Dec 10, 2024 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) …

Jul 3, 2023 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) …

DISCO Technical Review 有关 Kiru（切）・Kezuru（削）・Migaku（磨）技术的见解和论文。

Dec 12, 2023 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) …

This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the KABRA layer. In …

“Advanced Kiru, Kezuru and Migaku technologies” is DISCO’s business domain. In other words, DISCO will never deviate from the three technology fields of Kiru (cutting), Kezuru (grinding), and Migaku …

Please contact a DISCO representative with your product needs such as type, wheel size, and quantity. When you place the first order with us, please explain application information such as materials to …

NBC-ZH Series Hub Blade Electroformed bond Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO 3, etc.), etc

DGP8762 グラインダポリッシャ フルオートマチック Φ300 mmウェーハ対応 3軸4チャックテーブル

DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use. It performs a series of processes from HogoMax * coating and dicing to automatic cleaning. The …