Abstract: A collective die-to-wafer (CoD2W) assembly process is demonstrated enabling low-loss die-to-wafer evanescent optical coupling, paving the way to future wafer-level optically interconnected ...
Abstract: As CMOS scaling has slowed down, high-performance computing has turned to 2.5D and 3D heterogeneous integration to simultaneously increase density and ...
Katharine Paljug is a financial writer and editor with over a decade of industry experience. Her writing has covered nearly every aspect of the financial world, from investing in forex to paying for ...
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