Torbjörn Åhman on MSNOpinion

This experiment shows the limits of hand forging

This blacksmithing experiment explores how steel behaves when its movement is restricted. Using a closed die setup, the ...
Next Mashup

Forging Supplier Companies Driving Next-Gen Modern Forging Techniques

Forging supplier companies adopt next-gen forging techniques to deliver stronger, precise, and high-performance components.
IEEE

Collective die-to-wafer assembly process for optically interconnected System-on-wafer

Abstract: A collective die-to-wafer (CoD2W) assembly process is demonstrated enabling low-loss die-to-wafer evanescent optical coupling, paving the way to future wafer-level optically interconnected ...
IEEE

Effect of Copper Residual Ratios of High-Density PCB on Chip Warpage During Die Bonding Process

Abstract: High-density interconnect printed circuit boards (HDI-PCBs) have been widely used in complex electronic products from mobile phones to computers. Warpage is a key issue affecting their ...