Electrical and Computer Engineering - Carnegie Mellon University

3D Chip Breakthrough to Accelerate AI

CMU, Stanford, Penn, MIT, and SkyWater Technology achieved a milestone with the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed ...
Ohio University

Training the next generation of cybersecurity professionals: OHIO to enrich cybersecurity curriculum with innovative NIST grant

The National Institute of Standards and Technology (NIST) recently awarded Ohio University’s J. Warren School of Emerging ...
Interesting Engineering

China activates massive distributed AI system spanning 1,243 miles nationwide

China activates a 1,243 miles distributed AI supercomputer network linking data centers with near-single-system efficiency.

Quilter's AI just designed an 843‑part Linux computer that booted on the first try. Hardware will never be the same.

Quilter's AI designed a working 843-component Linux computer in 38 hours—a task that typically takes engineers 11 weeks. Here ...