The Marin County Digital Accelerator takes an agile approach to gov tech, moving fast to get work done. A recent project ...

Smartphones in 2026 will bring major upgrades in AI, connectivity and design, creating devices that feel smarter and more ...

Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

Industry leaders share their 2026 tech predictions, covering AI at scale, cloud autonomy, security risk, observability, ...

NoC supplier Arteris’ acquisition of hardware security specialist Cycuity will help chip designers improve data movement ...

Astronomers have produced the first continuous, two-dimensional maps of the outer edge of the sun's atmosphere, a shifting, ...

Barclays 23rd Annual Global Technology Conference December 10, 2025 4:20 PM ESTCompany ParticipantsStephen Vintz - ...

South Korean shipping giant Hanwha Group has teamed up with U.S. defense startup Vatn Systems to develop autonomous ...

Titomic partnered with Rensselaer Polytechnic Institute and the National Science Foundation to achieve superior adhesion and precision.

Abstract: Tunnel seismic prediction (TSP) plays a critical role in ensuring the safety of tunnel construction; however, traditional methodologies encounter challenges related to detection range, ...

A 3D-printed Janus microchannel heat sink inspired by desert beetles enables ultrafast bubble removal and prevents CPU thermal throttling.

NASA funds new software to enhance drone navigation over featureless Martian terrain. This initiative supports autonomous ...