H-bridge buck-boost ICs are widely used in applications requiring a constant voltage or current source even when the system ...

MIT’s prototype points to a future where chips move data millimeters less and save orders of magnitude more energy.

MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.

As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has sh ...

A chiplet marketplace would require deep changes in the design-through-manufacturing flow.

A new atomically precise carbon sheet combines nanoporous graphene and biphenylene stripes, offering controlled ...

There are plenty of well-known models among the 8-bit machines of the 1980s, and most readers could rattle them off without a ...

Build festive decorations using Arduino and Raspberry Pi with these five creative holiday projects and video tutorials ...

EcoWatt Power Saver revealed: discover how this plug-in energy device enhances home power flow, supports efficiency, and ...

Kioxia’s flash memory roadmap is shaping up for a busy two-year cycle, with BiCS9 set for mass production at the end of fiscal 2025 and the more advanced BiCS10 arriving in 2026.

Microsoft, Nvidia and Anthropic just formed the latest closed-loop artificial intelligence partnership, tying cloud, hardware ...