Engineers use a redistribution layer (RDL) in flip-chip designs to redistribute I/O pads to bump pads without changing the I/O pad placement. However, traditional routing capacity may be insufficient ...
The semiconductor industry is in a new age where device scaling will not continue to provide the cost reductions or performance improvements at a similar rate to past years when Moore’s law was the ...
CAMPBELL, Calif.--(BUSINESS WIRE)--Imperative Care, a medical technology company developing connected innovations to elevate care for people affected by stroke and other ischemic diseases, today ...
How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...
With the rise of smart devices, applications for semiconductor components are quickly expanding. The requirements for chip size, information transmission speed, and power in network communications, ...
SAN JOSE, Calif. — Denali, Mentor, MIPS and Rambus on Thursday (Dec. 15) announced the formation of an alliance to promote industry-wide adoption of a Register Description Language (RDL) in the ...
SHAKER HEIGHTS, Ohio -- City Council on Monday approved a new three-year firefighters’ contract that includes 3.5 percent annual pay raises. The new contract eliminates the need for a state mediator’s ...
Not for distribution to U.S. newswire services or dissemination in the United States TORONTO, Dec. 19, 2025 (GLOBE NEWSWIRE) ...
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