Fujitsu has developed a new cooling solution aimed at compact electronic devices. The new heatpipe cooler design, measuring just 1mm at its thickest is said to be "capable of transferring ...

Scientists from Nagoya University in Japan have developed an innovative cooling device—an ultra-thin loop heat pipe—that significantly improves heat control for electronic components in smartphones ...

Fujitsu Laboratories has released details of a new heatpipe design built for slim electronics, boasting a sub-millimetre thickness and five times greater heat transfer than existing solutions.

Researchers have developed a loop heat pipe that can transport up to 10 kW of heat without the need for electricity. A team of researchers from Nagoya University in Japan has developed a loop heat ...

Over the past decade, the use of heat pipes in electronic cooling applications has increased dramatically, primarily in notebook computers. In fact, virtually every notebook computer manufactured ...

With a thickness of just 0.3 mm, the new UTLHP fits within slim modern phones without making them heavier, works effectively regardless of how you hold your phone, and can handle heat levels for ...