Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are ...

The Dual Cool™ package is a top-side cooling PQFN device that incorporates new packaging technology which enables additional power dissipation through the top of the package resulting in more than 60 ...

In the arena of business ethics, the phrase "do no harm" is central to the ideal of how businesses should conduct themselves. Variations on the theme such as "do no evil," adopted by Google's ...